48804888 Sn63/Pb37 RA Solder Wire is electronics grade solder wire. This 63/37 solder uses the eutectic tin-to-lead alloy ratio, which is complemented with an RA-like flux core. This tin-lead solder wire meets J-STD-004B, ASTM B 32, and exceeds J-STD-006C specifications. It is one of the easiest solders to work with because it offers a low-melting temperature with a sharp melting/solidification point, which results in robust and reliable joints that are highly resistant to whisker formation.

This 63/37 rosin core solder achieves a consistent solder and flux percentage thanks to our state-of-the-art extrusion wire-drawing machine, which continuously monitors the wire to prevent voids and ensure consistency, providing a top-grade solder wire.

Features:

• Eutectic alloy (liquidus = solidus temperature)
• Alloy exceeds J-STD-006C and meets ASTM B 32 purity requirements
• Flux meets J-STD-004B
• Rosin-activated flux
• Fast wetting
• Fast flowing
• Non-corrosive residue
• Non-conductive residue

Specifications:

• Type: Wire Solder
• Composition: Sn63Pb37 (63/37)
• Diameter: 0.050″ (1.27mm)
• Melting Point: 361F (183C)
• Flux Type: Rosin Activated (RA)
• Wire Gauge: 16 AWG, 18 SWG
• Process: Leaded
• Form: Spool, 1 lb (454 g)
• Shelf Life: 60 Months
• Shelf Life Start: Date of Manufacture
• Storage/Refrigeration Temperature: 50F ~ 86F (10C ~ 30C)

Datasheet

MSDS